Detection and Analysis of Flux Dynamic Spreading Process in Flip-chip Dipping Process based on Image Processing

Detection and Analysis of Flux Dynamic Spreading Process in Flip-chip Dipping Process based on Image Processing

 

 

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High-speed cameras in the military, biomedical, energy and chemical industry has a wide range of applications. The authors introduce firstly image processing of pictures captured by High-Speed Cameras into detection and analysis of dipping process. This method can be applied to many researches such as particle velocimetry in energy and chemical fields, Simulation test equipment in Sports Field etc.

The dipping process was controlled by the high-speed camera system and the effects on dipping results influenced by flux viscosity, speed, acceleration, acceleration time and dipping time were analyzed. The detection and analysis process provides an effective reference in choosing precise flux coating technological parameters. From this paper, we can get these findings:

  • The influence of flux viscosity on dipping is evident, and the micelle is eliminated by the low-viscosity flux glue efficiently.
  • The dipping process was recorded by the high-speed camera system and is indicated by the real-time curve.
  • During the dipping process it’s not good for very low speed, because sometime will lead to small micelle between the bumps.
  • Dipping flux quantity has an increasing trend for acceleration time or has a decreasing trend for acceleration.
  • As dipping time increases, dipping flux quantity increases until the dipping time is 55ms, because it has been saturated at that time

Original article citation

Junhui Li, Yang Xia, Wei Wang, Fuliang Wang, Wei Zhang, and Wenhui Zhu, “Dipping Process Characteristics Based on Image Processing of Pictures Captured by High-speed Cameras”, Nano-Micro Lett. 7(1), 1-11 (2015). doi:10.1007/s40820-014-0012-6

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